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Thermal grease GD900 heat sink compound paste silicone 30 gramCooling paste
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  • Thermal grease GD900 heat sink compound paste silicone 30 gramCooling paste
  • Thermal grease GD900 heat sink compound paste silicone 30 gramCooling paste
  • Thermal grease GD900 heat sink compound paste silicone 30 gramCooling paste
  • Thermal grease GD900 heat sink compound paste silicone 30 gramCooling paste

Thermal grease GD900 heat sink compound paste silicone 30 gram

€7.99
.
  • GD900 Silicone thermal grease paste 
  • High temperature and water resistance
  • High effective and reliable to use
  • Operation Temperature : -50~200°C
  • Thermal Conductivity : > 4.8 w/m-k
  • Specific Gravity: > 2.3 g/cm3
  • Material: silicone
  • Weight: 30g
  • Uses: CPU, graphics card, and other hot chips.
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Normally shipped within 24-48 hours

 

14 days return policy

 

  • Product Overview:
    The GD900 Silicone Thermal Grease Paste is a high-performance thermal interface material designed to enhance heat dissipation in electronic components. It is particularly effective for CPUs, graphics cards, and other heat-intensive chips, ensuring reliable operation and longevity.

    Key Features:

    • High Temperature Resistance: Operates effectively within a temperature range of -50°C to 200°C, making it suitable for demanding applications.

    • Water Resistance: Offers protection against moisture, ensuring consistent performance in various environments.

    • Thermal Conductivity: Features a thermal conductivity of greater than 4.8 W/m-K, providing efficient heat transfer and reducing component temperatures.

    • Specific Gravity: Has a specific gravity of greater than 2.3 g/cm³, indicating a dense and effective thermal compound.

    • Material: Made from silicone, ensuring durability and stability over time.

    • Weight: Available in a convenient 30g package, suitable for multiple applications.

    Benefits:

    • Enhanced Heat Dissipation: Reduces thermal stress on components, improving their lifespan and performance.

    • Reliability: Provides consistent and reliable thermal conductivity, even in extreme temperatures.

    • Versatility: Suitable for a variety of electronic components, including CPUs and graphics cards.

 

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